JPH0553873B2 - - Google Patents
Info
- Publication number
- JPH0553873B2 JPH0553873B2 JP62223708A JP22370887A JPH0553873B2 JP H0553873 B2 JPH0553873 B2 JP H0553873B2 JP 62223708 A JP62223708 A JP 62223708A JP 22370887 A JP22370887 A JP 22370887A JP H0553873 B2 JPH0553873 B2 JP H0553873B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- chemical
- plating
- solution
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22370887A JPS6468478A (en) | 1987-09-07 | 1987-09-07 | Metal plating method using silver hydrosol |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22370887A JPS6468478A (en) | 1987-09-07 | 1987-09-07 | Metal plating method using silver hydrosol |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6468478A JPS6468478A (en) | 1989-03-14 |
JPH0553873B2 true JPH0553873B2 (en]) | 1993-08-11 |
Family
ID=16802417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22370887A Granted JPS6468478A (en) | 1987-09-07 | 1987-09-07 | Metal plating method using silver hydrosol |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6468478A (en]) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO304746B1 (no) * | 1989-05-04 | 1999-02-08 | Ad Tech Holdings Ltd | Gjenstand som motstÕr mikrobiologisk vekst bestÕende av et ikke-ledende subtrat som er belagt med et trat som er belagt medfremgangsmate for a avsette |
JPH0757907B2 (ja) * | 1989-09-18 | 1995-06-21 | 静岡県 | 電気絶縁体への無電解めっき法 |
US6780467B2 (en) | 2000-04-25 | 2004-08-24 | Nikko Materials Co., Ltd. | Plating pretreatment agent and metal plating method using the same |
US7767009B2 (en) | 2005-09-14 | 2010-08-03 | OMG Electronic Chemicals, Inc. | Solution and process for improving the solderability of a metal surface |
JP5594449B2 (ja) | 2012-09-20 | 2014-09-24 | Dic株式会社 | 導電性材料及びその製造方法 |
JP5648232B1 (ja) | 2013-06-21 | 2015-01-07 | Dic株式会社 | 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法 |
JP6129001B2 (ja) * | 2013-07-17 | 2017-05-17 | 名古屋メッキ工業株式会社 | 有機繊維材料の無電解金属めっき処理方法 |
CN109440453A (zh) * | 2018-10-22 | 2019-03-08 | 复旦大学 | 一种Cu-Ni-Gd-B-P电子织物的制备方法 |
JP7573322B1 (ja) * | 2023-10-30 | 2024-10-25 | 奥野製薬工業株式会社 | 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59120249A (ja) * | 1982-12-27 | 1984-07-11 | Agency Of Ind Science & Technol | 貴金属触媒の製造方法 |
JPS6263676A (ja) * | 1985-09-14 | 1987-03-20 | Agency Of Ind Science & Technol | ポリエチレンテレフタレ−トフイルムの強磁性金属めつき方法 |
-
1987
- 1987-09-07 JP JP22370887A patent/JPS6468478A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6468478A (en) | 1989-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
EXPY | Cancellation because of completion of term |